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Moisture Resistant ESD Safe MOS Capacitors 470 pF 30V Single Layer Chip for Broadband RF Decoupling

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Moisture Resistant ESD Safe MOS Capacitors 470 pF 30V Single Layer Chip for Broadband RF Decoupling

Delivery Time : 5-7 working days for stock, 3-4 weeks for production

Backside Metallization : TiW-Pt-Au (Au 1.0µm min)

Storage Temperature : -65°C to +150°C

Brand Name : Hoan

Model Number : HMR471S30V500

MOQ : 10 Pieces

Mounting Type : Wire Bondable / Eutectic Die Attach

Top Metallization : TiW (100nm) + Au (2.5µm min)

RoHS : Compliant (EU 2015/863)

Customization : Capacitance value, chip geometry, metallization and packaging on request

Chip Dimensions : 0.50 × 0.50 × 0.15 mm

Payment Terms : T/T,L/C,D/A,D/P

Place of Origin : Shaanxi, China

Certification : ISO 9001:2015, RoHS

Operating Temperature : -55°C to +125°C

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Moisture Resistant ESD Safe MOS Capacitor 470 pF 30V Single Layer Chip for Broadband RF Decoupling


Summary: The HMR471S30V500 is a single-layer MOS chip capacitor rated 470 pF / 30 V DC, fabricated on float-zone silicon with a dense thermal SiO&sub2; dielectric and a TiW-Pt-Au metallization system. It combines robust moisture performance (MSL 1, no bulk absorption) with electrostatic robustness and very low parasitic inductance, making it a single-layer MOS capacitor option for broadband RF decoupling in humid, outdoor and automotive environments. Capacitance value, chip geometry, and packaging are customizable.


Key Specifications at a Glance


  • Capacitance: 470 pF ±10% (tolerance options ±5%)
  • Rated voltage: 30 V DC, dielectric strength >100 V DC
  • Intrinsic chip ESL: <0.05 nH (single-layer vertical current path)
  • Temperature coefficient: +35 ppm/°C, −55 °C to +125 °C
  • Moisture: MSL 1; biased-humidity drift <0.1% over 1000 h
  • ESD: class 0 (HBM); silver-free metallization
  • Chip size: 0.50 × 0.50 × 0.15 mm; wire bondable / eutectic die attach


Full Electrical Specifications (T = 25 °C unless noted)


Parameter Value Test Condition
Capacitance 470 pF ±10% 1 MHz, 1.0 Vrms
Tolerance options ±10% (K), ±5% (J) —
Rated DC voltage 30 V Continuous
Dielectric strength >100 V DC 1 min, 25 °C
Intrinsic chip ESL <0.05 nH De-embedded from S-parameters
Q factor @ 1 MHz >2000 Typical
ESR @ 1 GHz <0.1 Ω Typical
TCC +35 ppm/°C −55 °C to +125 °C
Moisture sensitivity level MSL 1 J-STD-020, unlimited floor life
Biased humidity drift <0.1% 1000 h, 85 °C/85% RH, 30 V
Leakage current <10 nA (dry) / <20 nA (post-humidity) 30 V DC
Dielectric / substrate Thermal SiO&sub2; 300 nm / float-zone Si >1000 Ω·cm —
Operating / storage −55 to +125 °C / −65 to +150 °C —
RoHS Compliant EU 2015/863


Typical Applications


  • Outdoor remote radio units (RRU) exposed to condensation and thermal cycling
  • Automotive electronic control units (road salt, humidity, temperature swings)
  • Industrial IoT sensor nodes in unconditioned factory or agricultural environments
  • Marine and coastal communication electronics in salt-laden air
  • Medical wearable electronics subject to perspiration and body-worn humidity


Moisture Resistant ESD Safe MOS Capacitors 470 pF 30V Single Layer Chip for Broadband RF Decoupling


Product Tags:

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